Beli Amplas Fiber di monotaro.id

- Valkanized circuit board fiber substrate is used, and it is a disc abrasive excellent in heat resistance.- Silicon carbide abrasive grains are used.- It can be attached to the disc grinder to rust removal, burred, paint film peeling, stone poli

-Valkanized circuit board fiber substrate is used, and it is a disc abrasive excellent in heat resistance.-Silicon carbide abrasive grains are used.-It can be attached to the disc grinder to rust removal, burred, paint film peeling, stone polishing etc ef-Bead removal of welded portions: #14 to #24.-Rust remover of hull/car body: #24 to #60.-Burr removal of metal: #40 to #80.-Polishing of stone material (medium finish): #80 to #120.-Removal of Rough Coating: #80 to #120.

-A ceramic whetstone specifically designed for surface coarseness.-Unlike the structure of conventional whetstones, because alumina fibers with high homogeneity are adopted instead of abrasive grains, there is no dropout of abrasive grains and no clogging occurs. -Electric discharge machining and surface finishing after cutting.

-Highest Quality Ceramic Whetstone.-Very high grinding ability, and it finishes the surface uniformly and at the same time, it removes the hardened layer after electric discharge processing, and processing stage gaps smoothly.-Unlike conventional grindstones, because alumina long fibers with high homogeneity are adopted instead of abrasive grains, there is no dropout of abrasive grains and no clogging occurs.-The bending strength is the highest, making it difficult to break. -Electric discharge machining and surface finishing after cutting.

Use:Suitable for stainless steel, steel material, grinding and polishing.Ranging from general polishing up to heavy grinding.Deburring, metal hand tools, bead removal, removing black scale.

-Double sided tapes type. It can be attached to an electric/pneumatic tool.-Possible to cut to the required size and use.-Can be used for any applications from flat polishing of difficult-to-cut material to polishing of details.-Can be used both dry type-Repair of molding die, R removal, finishing.-Surface polishing, chamfer, R removal etc., of glass, quartz glass, stone, carbide, carbon, FRP and plastic, etc.